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US 2015/0144972 A1Published application
Matrix leadframe for led packaging
AssigneeKoninklijke Philips N.V.
InventorsChee Weng Soong, Paul Scott Martin, Tomonari Ishikawa
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Abstract
A leadframe (610) is formed that simplifies the packaging of light emitting elements and/or eliminates the need for stress-inducing folding after encapsulation. In particular, the folding of the contact tabs (505, 506) for surface mounting is performed prior to the mounting and encapsulation of the light emitting elements on the leadframe. In an example embodiment, the leadframe may be formed so that an array, or matrix, of light emitting elements may be packaged during a single packaging process.
Claims15
A leadframe comprising:
- a plurality of LED metal patterns, each LED metal pattern comprising:
- a first plane, the first plane comprising:
- a surface area for mounting a light emitting element, and
- at least one tie bar,
- a pair of contact pads for external coupling to the light emitting element, and
- a plurality of at least four folds that are formed so that the contact pads lie in a second plane that is substantially parallel to the surface area for mounting the light emitting element.
3 more elements
A method comprising:
- creating a plurality of LED metal patterns on a leadframe, each LED metal pattern comprising:
- a first plane, the first plane comprising:
- a surface area for mounting a light emitting element, and
- at least one tie bar, and
- a pair of contact pads for external coupling to the light emitting element, and
- folding the leadframe along at least four fold lines to pre-form the leadframe such that the contact pads lie in a second plane that is substantially parallel to the first plane for mounting the light emitting element, after the folding:
- situating each of a plurality of light emitting elements on each of the surface areas, each light emitting element having at least two electrodes,
- coupling the at least two electrodes of each light emitting element to the pair of contact pads,
- encapsulating the surface areas containing the light emitting elements with an encapsulant, forming a plurality of encapsulated light emitting devices, and
- slicing the lead frame to provide a plurality of singulated light emitting devices.
7 more elements
Dependencies are inferred from the claim text.