Chip scale light emitting device with metal pillars in a molding compound formed at wafer level

A light emitting device comprising:

• a light emitting structure comprising an active region that is sandwiched between an N-region and a P-region, and includes a first contact to the N-region and a second contact to the P-region,
• a plurality of at least four metal pillars, at least a first pillar being coupled to the first contact and at least a second pillar coupled to the second contact,
• a filler material that occupies space between the pillars, and
• a first pad and second pad that are coupled to the first pillar and second pillar, respectively, and provide external coupling to the N-region and P-region via the first and second pillars,
• wherein one or more of the plurality of pillars are inactive, such that during operation of the light emitting structure, no current flows through the inactive pillars.

A wafer comprising:

• a substrate;
• a plurality of light emitting structures on the substrate, each light emitting structure including:
• a light emitting structure comprising an active region that is sandwiched between an N-region and a P-region, and includes a first contact to the N-region and a second contact to the P-region,
• a plurality of at least four metal pillars, at least a first pillar being coupled to the first contact and at least a second pillar coupled to the second contact,
• a filler material that occupies space between the pillars, and
• a first pad and second pad that are coupled to the first pillar and second pillar, respectively, and provide external coupling to the N-region and P-region via the first and second pillars, and
• at least one metal segment that interconnects at least two of the light emitting structures.