Solder material and bonded structure

Solder material used in soldering of an Au (gold) electrode including Au plating on Ni (nickel) plating containing P (phosphorous), comprising:

• Ag (silver) satisfying 0.3≦[Ag]≦4.0;
• where 0.5 mass % and 1.0 mass % of Ag are excluded,
• Bi (bismuth) satisfying 0≦[Bi]≦1.0;
• and
• Cu (copper) satisfying 0.2≦[Cu]≦1.2;
• and
• further comprising:
• In (indium) in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0.2≦[Cu]<0.5;
• In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0;
• In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2,
• with a balance including only not less than 87 mass % of Sn (tin),
• where contents (mass %) of Ag, Bi, Cu, and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively.