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US 2015/0144385 A1Published application
Circuit board and electronic apparatus including the same
AssigneeKYOCERA Corporation
InventorsYoshio Ohashi, Kunihide Shikata
Life of this patent
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Abstract
The circuit board includes a ceramic sintered body and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, and when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the length of an interface between the glass layer and the metal wiring layer to a length of the glass layer in a direction along the primary surface is 1.25 to 1.80.
Claims6
A circuit board comprising:
- a ceramic sintered body;
- and a metal wiring layer provided on at least one primary surface thereof with a glass layer interposed therebetween, wherein when the cross section of the circuit board perpendicular to the primary surface of the ceramic sintered body is viewed, the ratio of the interface length between the glass layer and the metal wiring layer to the length of the glass layer in a direction along the primary surface is 1.25 to 1.80.
Dependencies are inferred from the claim text.