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US 2015/0144255 A1Published application
Method of forming a touch panel
AssigneeHengHao Technology Co. LTD
InventorYEN-CHUN PENG
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Abstract
A method of forming a touch panel includes bonding a transparent conductive transfer film (TCTF) with a cover layer, followed by patterning the TCTF into a first electrode layer. A second electrode layer is formed on a top surface of a transparent substrate, followed by forming an adhesive layer above the second electrode layer. Finally, a bottom surface of the first electrode layer is bonded with a top surface of the adhesive layer, thereby resulting in the touch panel.
Claims12
A method of forming a touch panel, comprising:
- providing a cover layer;
- bonding a transparent conductive transfer film (TCTF) with the cover layer;
- patterning the TCTF into a first electrode layer;
- providing a transparent substrate;
- forming a second electrode layer on a top surface of the transparent substrate;
- forming an adhesive layer above the second electrode layer;
- and
- bonding a bottom surface of the first electrode layer with a top surface of the adhesive layer, thereby resulting in the touch panel.
5 more elements
Dependencies are inferred from the claim text.