Package, electronic component mounted package, physical quantity sensor, electronic device, and moving object
AssigneeSeiko Epson Corporation
InventorShinya AOKI
Life of this patent
Estimating the term…
Abstract
A physical quantity sensor includes a base on which an IC electrically connected to a gyro element is arranged and a wire group arranged on the base. The base includes a first outer edge and a second outer edge that crosses the first outer edge. The wire group includes a CLK wire arranged along the first outer edge and including an internal terminal connected to the IC and an S1 wire arranged along the second outer edge and including an internal terminal connected to the IC. A detection signal of the gyro element is input to the IC via the S1 wire.
Claims18
A package comprising:
- a base on which an electronic component is arranged;
- and
- a plurality of wires arranged on the base, wherein the wires include:
- a plurality of first wires including internal terminals connected to the electronic component;
- and
- a plurality of second wires including internal terminals connected to the electronic component,
- the internal terminals of the first wires are arranged side by side overlap with a first axis,
- the internal terminals of the second wires are arranged side by side overlap with a second axis that crosses the first axis,
- the second wires include a detection signal wire electrically connected to a detection electrode of a physical quantity detection element mounted on the base,
- the first wires include a digital signal wire for transmitting a digital signal output from the electronic component, and
- an internal terminal of the digital signal wire is arranged on an opposite side of the second axis with respect to a center line in the first axis direction in the internal terminals of the first wires.
A package comprising:
- a base on which an electronic component is arranged;
- and
- a plurality of wires arranged on the base, wherein
- the wires include:
- a plurality of first wires including internal terminals connected to the electronic component;
- and
- a plurality of second wires including internal terminals connected to the electronic component,
- the first wires include a digital signal wire for transmitting a digital signal output from the electronic component,
- the second wires include a detection signal wire electrically connected to a detection electrode of a physical quantity detection element mounted on the base, and
- at least one of a ground wire and a fixed potential wire having fixed potential is arranged between the digital signal wire and the detection signal wire.
An electronic component mounted package comprising:
- a base;
- an electronic component arranged on the base;
- a first wire connected to the electronic component;
- a second wire connected to the electronic component;
- a first conductive wire that connects the electronic component and the first wire;
- and
- a second conductive wire that connects the electronic component and the second wire, wherein
- the first wire includes a digital signal wire for transmitting a digital signal output from the electronic component,
- the second wire includes a detection signal wire electrically connected to a detection electrode of a physical quantity detection element mounted on the base,
- in a plan view of the base, an extending direction of the first conductive wire connected to the digital signal wire and an extending direction of the second conductive wire connected to the detection signal wire cross each other.
Dependencies are inferred from the claim text.