Carrier for manufacturing printed circuit board and manufacturing method thereof, and method for manufacturing printed circuit board

Abstract

Disclosed herein is a carrier for manufacturing a printed circuit board, including: an insulating layer; a release layer buried in at least any one of top and bottom surfaces of the insulating layer and having a length shorter than that of the insulating layer; and a metal foil bonded to a surface of the insulating layer in which the release layer is buried and having a length longer than that of the release layer, thereby increasing reliability of a product in the manufacturing the substrate using the carrier.

Dependencies are inferred from the claim text.