Forming integrated inductors and transformers with embedded magnetic cores
OwnerAnindya Poddarinventor
Life of this patent
Estimating the term…
Abstract
In accordance with an embodiment of the application a method of forming an integrated magnetic device is described. A prepreg or core is mounted on a carrier. A winding layer is plated and patterned on the prepreg or core. Vias are plated. The silicon is placed on a die attach pad, ensuring sufficient clearance of die to vias and d/a char. The assembly is laminated and grinded to expose the vias. A 2nd layer of vias is provided by sputtering or plating followed by laminating assembly; and grinding assembly to expose vias. The windings are plated and patterned. A solder mask (SMSK) is applied and assembly finished.
Claims13
A method of forming an integrated magnetic device package assembly, the method comprising:
- mounting a on a carrier;
- plating and patterning a winding layer on the core;
- providing a plurality of vias;
- plating the plurality of vias;
- placing silicon on a die attach pad, ensuring sufficient clearance of die to vias;
- laminating the assembly;
- grinding the assembly to expose the plurality of vias;
- providing a second layer of vias by sputtering;
- laminating the assembly again;
- grinding the assembly to expose the vias;
- plating and patterning the windings;
- and
- solder mask SMSK.
A method of forming an integrated magnetic device package assembly, the method comprising:
- planarizing a copper CU sheet;
- applying an insulating layer to the top surface of the Cu sheet;
- sputtering a plurality of magnetic layers on the top surface of the insulating layer;
- pattern the magnetic layers;
- etch the magnetic layers;
- plating a plurality of vias;
- annealing a magnetic material of the magnetic layers in a magnetic field;
- laminating the assemblies using film;
- grinding the assemblies to expose the plurality of vias;
- plating and patterning a plurality of windings;
- laminating a top number of windings of the plurality of windings;
- stripping the CU sheet from assembly;
- applying and patterning a bottom number of windings of the plurality of windings;
- and
- solder mask (SMSK).
Dependencies are inferred from the claim text.