Method for fastening chips with a contact element onto a substrate provided with a functional layer having openings for the chip contact elements

Abstract

A method for tacking of chips onto a substrate at chip positions which are distributed on a surface of the substrate. The method includes the following steps: formation or application of a function layer onto the substrate, removing the function layer from the substrate at the chip positions at least in the region of contacts to uncover the contacts, tacking chips onto one chip contact side of the function layer at the chip positions and contacting the chips with the contacts via contact elements.

Dependencies are inferred from the claim text.