Epoxy resin, method for producing expoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material

A method for producing an epoxy resin, the method comprising reacting a diol compound (a) with at least one diglycidyl ether compound (q), the diol compound (a) being represented by general formula (1),

• {in the formula, Y each independently represent a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms;
• X represents a single bond, a —O— group, a —CH═CH— group, a —CH═C(CH3)— group, a —CH═C(CN)— group, a —C≡C— group, a —CH═N— group, a —CH═CH—CO— group, a —N═N— group, a —COO— group, a —CONH— group, or a —CO— group;
• 1 each independently represent an integer of 0 to 4;
• and m represents an integer of 1 to 3}, or general formula (2) below,
• {in the formula, Z each independently represent a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms}, and the at least one diglycidyl ether compound (q) being selected from the group consisting of a diglycidyl ether of a linear alkylene diol having 1 to 9 carbon atoms, a diglycidyl ether of a branched alkylene diol having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene diol, and a diglycidyl ether of a diol compound having an ether bond present between two continuous methylene groups in the alkylene diol.

An epoxy resin composition comprising an epoxy resin and a curing agent, the epoxy resin being represented by general formula (I) below,

• [in the formula, Q each independently represent a linear alkylene chain having 1 to 9 carbon atoms, a branched alkylene chain having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain;
• A each independently represent a phenylene unit represented by general formula (i) below
• {in the formula, Y each independently represent a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms;
• X represents a single bond, a —O— group, a —CH═CH— group, a —CH═C(CH3)— group, a —CH═C(CN)— group, a —C≡C— group, a —CH═N— group, a —CH═CH—CO— group, a —N═N— group, a —COO— group, a —CONH— group, or a —CO— group;
• 1 each independently represent an integer of 0 to 4;
• and m represents an integer of 1 to 3}, or a naphthylene unit represented by general formula (ii) below
• {in the formula, Z each independently represent a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms};
• and n represents an integer of 0 to 10].

A heat-dissipating resin material comprising an epoxy resin, a curing agent, and an inorganic filler, the epoxy resin being represented by general formula (I) below,

• [in the formula, Q each independently represent a linear alkylene chain having 1 to 9 carbon atoms, a branched alkylene chain having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain;
• A each independently represent a phenylene unit represented by general formula (i) below
• {in the formula, Y each independently represent a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms;
• X represents a single bond, a —O— group, a —CH═CH— group, a —CH═C(CH3)— group, a —CH═C(CN)— group, a —C≡C— group, a —CH═N— group, a CH═CH—CO— group, a —N═N— group, a —COO— group, a —CONH— group, or a —CO— group;
• 1 each independently represent an integer of 0 to 4;
• and m represents an integer of 1 to 3}, or a naphthylene unit represented by general formula (ii) below
• {in the formula, Z each independently represent a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms};
• and n represents an integer of 0 to 10], wherein a ratio of the inorganic filler is within a range of 20% to 95% by mass.

A semiconductor encapsulating material comprising an epoxy resin, a curing agent, and an inorganic filler, the epoxy resin being represented by general formula (I) below,

• [in the formula, Q each independently represent a linear alkylene chain having 1 to 9 carbon atoms, a branched alkylene chain having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain;
• A each independently represent a phenylene unit represented by general formula (i) below
• {in the formula, Y each independently represent a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms;
• X represents a single bond, a —O— group, a —CH═CH— group, a —CH═C(CH3)— group, a —CH═C(CN)— group, a —C≡C— group, a —CH═N— group, a —CH═CH—CO— group, a —N═N— group, a —COO— group, a —CONH— group, or a —CO— group;
• 1 each independently represent an integer of 0 to 4;
• and m represents an integer of 1 to 3}, or a naphthylene unit represented by general formula (ii) below
• {in the formula, Z each independently represent a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms};
• and n represents an integer of 0 to 10], wherein a ratio of the inorganic filler is within a range of 20% to 95% by mass.

A circuit board produced by heat-pressure-molding a plate-shaped material and a copper foil laminated on a surface of the plate, the plate-shaped material being composed of a varnish containing an epoxy resin, a curing agent, and an organic solvent, and the epoxy resin being represented by general formula (I) below,

• [in the formula, Q each independently represent a linear alkylene chain having 1 to 9 carbon atoms, a branched alkylene chain having a structure in which an alkyl group having 1 to 18 carbon atoms is bonded to a carbon atom of the linear alkylene chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain;
• A each independently represent a phenylene unit represented by general formula (i) below
• {in the formula, Y each independently represent a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms;
• X represents a single bond, a —O— group, a —CH═CH— group, a —CH═C(CH3)— group, a —CH═C(CN)— group, a —C≡C— group, a —CH═N— group, a —CH═CH—CO— group, a —N═N— group, a —COO— group, a —CONH— group, or a —CO— group;
• 1 each independently represent an integer of 0 to 4;
• and m represents an integer of 1 to 3}, or a naphthylene unit represented by general formula (ii) below
• {in the formula, Z each independently represent a hydrogen atom, a halogen atom, a hydrocarbon group having 1 to 8 carbon atoms, or an alkoxyl group having 1 to 8 carbon atoms};
• and n represents an integer of 0 to 10].