Method Of Manufacturing Multilayer Interconnects For Printed Electronic Systems
AssigneeOmega Optics, Inc.
InventorsHarish Subbaraman, Ray T. Chen
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Abstract
A fully additive method for forming multilayer electrical interconnects for printed electronic and/or optoelectronic devices is disclosed. Electrical interconnects are fabricated by directly ink-jet printing a dielectric material with selective interconnection holes, and then ink jet printing conductive patterns and filling the interconnection holes with conductive material to form multilayer interconnects. A method for manufacturing a multilayer printed electronic system utilizing the invention is also disclosed. Other embodiments are described and claimed.
Claims20
A method for manufacturing multilayer electrical interconnects comprising:
- ink jet printing a first dielectric layer on a substrate, wherein the substrate comprises one or more electronic or optoelectronic devices and one or more alignment marks;
- ink jet printing a first interconnection layer on the first dielectric layer;
- ink-jet printing a second dielectric layer on the first interconnection layer;
- and
- ink jet printing a second interconnection layer on the second dielectric layer.
A method for manufacturing multilayer printed electronic devices comprising:
- ink jet printing one or more alignment marks on a substrate;
- printing a first electronic device layer on the substrate, wherein the first electronic device layer comprises one or more electronic or optoelectronic devices;
- ink-jet printing a first dielectric layer on top of the first electronic device layer and the substrate;
- ink jet printing a first interconnection layer on top of the first dielectric layer;
- ink jet printing a second dielectric layer on top of the first dielectric layer and the first interconnection layer;
- printing a second electronic device layer on top of the second dielectric layer, wherein the second electronic device layer comprises additional one or more electronic or optoelectronic devices;
- and
- ink-jet printing a second interconnection layer on top of the second dielectric layer;
A method for manufacturing multilayer electrical interconnects comprising:
- ink jet printing one or more alignment marks on a substrate, wherein the substrate comprises one or more electronic or optoelectronic devices and one or more alignment marks;
- ink jet printing a first dielectric layer on the substrate;
- ink jet printing a first interconnection layer on the first dielectric layer;
- ink-jet printing a second dielectric layer on the first interconnection layer;
- and
- ink jet printing a second interconnection layer on the second dielectric layer.
Dependencies are inferred from the claim text.