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US 2015/0103498 A1Published application
Power module package and method of manufacturing the same
AssigneeFairchild Korea Semiconductor Ltd.
InventorsKeunhyuk Lee, Oseob Jeon, Joon-seo Son, Seungwon Im
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Abstract
Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.
Claims20
A power module package comprising:
- a substrate;
- at least one electrode arranged on the substrate;
- and
- an encapsulation member covering at least a portion of the substrate, the encapsulation member comprising a housing unit housing the at least one electrode,
- wherein the at least one electrode is spaced apart from and not contacted by the encapsulation member.
2 more elements
A method of manufacturing a power module package, the method comprising:
- arranging at least one semiconductor chip on a substrate;
- arranging at least one electrode on the substrate;
- forming a wiring member electrically connecting the at least one semiconductor chip and the at least one electrode;
- mounting the substrate on a bottom mold die and connecting on the bottom mold die to a top mold die, the top mold die comprising a first part and a second part, the first part defining a first space where the at least one semiconductor chip and the wiring member is housed, and the second part defining a second space where the at least one electrode is housed;
- and
- injecting an encapsulation material into the first space to cover at least a portion of the substrate, the at least one semiconductor chip, and the wiring member.
3 more elements
A power module package, comprising:
- a substrate;
- an electrode arranged on the substrate;
- and
- an encapsulation member encapsulating a portion of the substrate and encapsulating a portion of the electrode;
- wherein the electrode does not contact the encapsulation member and wherein the electrode has an upper surface and a portion of a side extending above the encapsulation member.
2 more elements
Dependencies are inferred from the claim text.