Electronic component module

An electronic component module comprising:

• a wiring substrate having a first and a second primary-surface facing each other;
• an electronic component mounted at least on the first primary surface of the wiring substrate;
• a conductive land formed at least on the first primary surface of the wiring substrate;
• a columnar connection terminal member which has a first and a second end surface facing each other, which is arranged so that the first end surface faces the conductive land, and which is bonded thereto with a bonding portion interposed therebetween;
• and
• a resin layer formed on the first primary surface of the wiring substrate so as to seal the electronic component and the connection terminal member while the second end surface of the connection terminal member is exposed,
• wherein the bonding portion contains a low-melting-point metal which is an Sn element or an alloy containing at least 70 percent by weight of Sn,
• a high-melting-point alloy formed of an intermetallic compound generated by the low-melting-point metal and a Cu—M-based alloy is arranged at least at the periphery of an end portion of the connection terminal member at a second end surface side so as to block the interface between the resin layer and the connection terminal member at the second end surface side of the connection terminal member, and
• the M comprises Ni and/or Mn.