Fingerprint sensor package and method for manufacturing same

A method of manufacturing a fingerprint sensor package, the method comprising:

• preparing a via frame comprising conductive via holes and a hollow;
• molding a die and the via frame to be integrated by a mold resin in a state that the die is placed in the hollow of the via frame;
• forming a first protective layer on an entire area on a side, in which a bonding pad is formed, of a structure comprising the molded die;
• selectively removing a predetermined area of the first protective layer;
• forming a conductive patter which comprises a connection electrode for connecting the bonding pad and the via hole of the die on the first protective layer, and a driving electrode for generating a driving signal for a fingerprint sensor;
• forming a second protective layer on an entire area of an upper surface in a structure comprising the conductive pattern;
• and
• forming a coating layer having black, white or another color on the second protective layer.

A method of manufacturing a fingerprint sensor package, the method comprising:

• preparing a via frame comprising conductive via holes and a hollow;
• attaching a molding tape for die attach and die molding to cover the hollow of the via frame;
• attaching a die to a center portion of the molding tape so that a bonding pad of the die can face the molding tape;
• molding the die and the via frame to be integrated by a mold resin (an epoxy molding compound (EMC));
• removing the molding tape;
• forming a first protective layer on an upper surface, from which the molding tape is removed, of a structure comprising the molded die, without forming the first protective layer in an area above the via hole and an area corresponding to the bonding pad;
• forming a connection electrode for connecting the bonding pad and the via hole of the die on the first protective layer, and a driving electrode for generating a driving signal for a fingerprint sensor;
• forming a second protective layer on an entire area of an upper surface in a structure comprising the conductive pattern;
• and
• forming a coating layer having black, white or another color on the second protective layer.