Micro-electro-mechanical system device with enhanced structural strength

A MEMS device with enhanced structural strength, comprising:

• a MEMS structure, including a plurality of metal layers;
• a fixing member, which is connected to a lateral side of the MEMS structure;
• and
• a signal transmission structure under the MEMS structure, for transmitting an electric signal generated by the MEMS structure;
• wherein a lowest metal layer of the MEMS structure is continuous to the fixing member at the lateral side of the MEMS structure and does not have a disconnection area above the signal transmission structure, and wherein the signal transmission structure does not comprise a metal layer as defined by CMOS manufacturing process terminology and the signal transmission structure includes a conductive wiring at a level below the metal layer.

A MEMS device with enhanced structural strength, comprising:

• a MEMS structure, including a plurality of metal layers;
• a fixing member, which is connected to a bottom of the MEMS structure;
• and
• a signal transmission structure under the MEMS structure for transmitting an electric signal generated by the MEMS structure;
• wherein the MEMS structure further includes a recess under the MEMS structure at a location above the signal transmission structure, and the recess is farther from the center of the MEMS structure than the fixing member is.