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US 2015/0102483 A1Published application
Microelectronic package with stress-tolerant solder bump pattern
AssigneeNVIDIA Corporation
InventorLeilei ZHANG
Life of this patent
Estimating the term…
Abstract
A microelectronic package includes larger diameter solder bumps and smaller diameter solder bumps for coupling an interposer to a packaging substrate. The larger diameter solder bumps are positioned on a peripheral surface of the interposer and the smaller diameter solder bumps are positioned on a center surface of the interposer. The solder bumps positioned in the peripheral region can more reliably withstand the higher mechanical stresses that occur in this peripheral region during operation of the microelectronic package.
Claims20
A microelectronic package, comprising:
- a semiconductor die mounted on a first side of an interposer that is formed from a semiconductor substrate;
- a first group of solder bumps coupled to a peripheral region of a second side of the interposer, wherein the first side of the interposer is opposite to the second side of the interposer;
- and
- a second group of solder bumps coupled to a center region of the second side of the interposer,
- wherein each solder bump in the first group has a diameter substantially equal to a first value, each solder bump in the second group has a diameter substantially equal to a second value, and the first value is greater than the second value.
2 more elements
A computing device, comprising:
- a microelectronic package that includes:
- a semiconductor die mounted on a first side of an interposer that is formed from a semiconductor substrate;
- a first group of solder bumps coupled to a peripheral region of a second side of the interposer, wherein the first side of the interposer is opposite to the second side of the interposer;
- and
- a second group of solder bumps coupled to a center region of the second side of the interposer,
- wherein each solder bump in the first group has a diameter substantially equal to a first value, each solder bump in the second group has a diameter substantially equal to a second value, and the first value is greater than the second value.
3 more elements
Dependencies are inferred from the claim text.