X-line routing for dense multi-chip-package interconnects

A semiconductor package, comprising:

• first and second adjacent semiconductor dies;
• a silicon interposer structure disposed below and electrically coupling the first and second semiconductor dies, and comprising a plurality of layers of conductive traces disposed above a substrate, a first pair of ground traces disposed in a first of the plurality of layers of conductive traces, a signal trace disposed in a second of the plurality of layers of conductive traces, below the first layer, and a second pair of ground traces disposed in a third of the plurality of layers of conductive traces, below the first layer, wherein the first and second pairs of ground traces and the signal trace provide an X-pattern routing from a cross-sectional perspective;
• and
• an organic package substrate disposed below and electrically coupled to the silicon interposer structure, the organic package substrate comprising a plurality of routing layers therein.