Quad flat no lead package and production method thereof

Abstract

The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

Dependencies are inferred from the claim text.