Package structure having mems element

16:

• The structure of claim 15, further comprising a first insulation layer provided on the encapsulant and the metallic traces and having a plurality of openings for exposing the metallic traces.

17:

• The structure of claim 15, further comprising a second insulation layer provided on the encapsulant and having a plurality of openings for exposing the first sub-bonding wires such that the metallic traces are provided in the openings and on the second insulation layer.

18:

• The structure of claim 15, wherein the electrical connection pads are disposed at an outer periphery of the lid.

19:

• The structure of claim 15, wherein each of the metallic traces has an end extending towards the MEMS element and having a bump provided thereon.

20:

• The structure of claim 15, wherein the metallic traces extend to the lid.

21:

• The structure of claim 15, wherein the lid has a metal layer provided thereon and the top surface of the encapsulant is flush with the metal layer.

23:

• The structure of claim 22, further comprising a first insulation layer provided on the encapsulant and the metallic traces and having a plurality of openings for exposing the metallic traces.

24:

• The structure of claim 22, further comprising a second insulation layer provided on the encapsulant and having a plurality of openings for exposing the first sub-bonding wires and second sub-bonding wires such that the metallic traces are provided in the openings and on the second insulation layer.

25:

• The structure of claim 22, wherein the electrical connection pads are disposed at an outer periphery of the lid.

26:

• The structure of claim 22, wherein each of the first sub-metallic traces has an end extending towards a periphery of the chip and having a bump provided thereon, and each of the second sub-metallic traces has an end extending towards the MEMS element and having a bump provided thereon.

27:

• The structure of claim 22, wherein the metal layer is composed of a plurality of bonding pads.