Electronic device and electronic device manufacturing method

An electronic device manufacturing method comprising:

• preparing a substrate;
• forming a bank above the substrate;
• applying ink within an aperture surrounded by the bank, thereby forming a semiconductor layer, the ink containing a semiconductor material;
• and
• forming a pair of electrodes electrically connected to the semiconductor layer, wherein
• an outline of the aperture in plan view includes a first edge that is a straight line segment, a second edge that is a straight line segment continuous with one end of the first edge via a first connector, and a third edge that is a straight line segment continuous with the other end of the first edge via a second connector, and
• the area of a first connector region differs from the area of a second connector region, the first connector region being defined by a first imaginary straight line extending along the first edge, a second imaginary straight line extending along the second edge, and the first connector, and the second connector region being defined by a third imaginary straight line extending along the third edge, the first imaginary straight line, and the second connector.