System for controlling thermal conductivity of electronic parts housing

Abstract

A system for controlling thermal conductivity of a housing of an electronic part is provided. In particular, liquid is disposed within a hollow portion formed between an external wall body and an internal wall body of the housing and a magnetic field generating member is attached to an outer surface of the internal wall body. Insulating magnetic particles are dispersed in the liquid, and an orientation of the insulating magnetic particles is changed according to a direction of a magnetic field applied by the magnetic field generating member. This, as a result, controls the thermal conductivity of the housing.

Dependencies are inferred from the claim text.