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US 2015/0092336 A1Published application
Apparatus and method for improving thermal energy transfer
AssigneeNokia Corporation
InventorsMezhgan SAMADY, Mikko Juhani TIMPERI, Romeo DUMPIT, Vincent PHAN, Cachaulo VAN LAANEN
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Abstract
An apparatus or method for providing thermal energy transfer comprising; a circuit board, a housing connected to the circuit board, at least one electronic component contained within said housing, said housing comprising a aperture, wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.
Claims25
An apparatus comprising:
- a circuit board,
- a housing connected to the circuit board,
- at least one electronic component contained within said housing,
- said housing comprising a aperture,
- wherein said housing is configured to receive a thermally conductive material through the aperture and said thermally conductive material couples thermal energy from said at least one electronic component.
2 more elements
A method for providing thermal energy transfer in an apparatus comprising:
- partially enclosing at least one electronic component in a housing;
- and
- inserting a thermally conductive material into at least a first aperture of said housing;
- and
- coupling the thermally conductive material to the electronic component.
2 more elements
An apparatus comprising:
- a circuit board,
- a housing connected to the circuit board,
- at least one electronic component contained within said housing,
- a thermally conductive material extending from within the housing and through an aperture in said housing.
1 more element
Dependencies are inferred from the claim text.