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US 2015/0091114 A1Published application
Elemental Stacked Image Sensor
OwnerBarmak Mansoorian, Daniel Van Blerkominventors
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Abstract
Provided herein is a novel stacked pixel design for image sensor applications. The stacked pixel designs may comprise a first and second wafer, wherein the first wafer is an elemental wafer comprising a photodiode and minimal additional components, such that material selection and processing steps of the first wafer may be optimized for the creation of a high quality photodiode. The second wafer comprises components necessary for the readout and reset of the photodiode on the first wafer.
Claims18
An stacked pixel comprising
- a first wafer, comprising a photodiode, a transfer gate, and two interconnects;
- and
- a second wafer, comprising a reset transistor, a source-follower amplifier, a row select transistor, and a column bus connection;
- wherein
- the two wafers are bonded together and are connected by one or more interconnects sufficient for ensuring the coordinated operation of the elements as a functional pixel.
2 more elements
An elemental wafer, comprising
- an array of pinned photodiodes, each photodiode having an adjacent transfer gate, a first interconnect connected to the transfer gate's gate terminal, and second interconnect connected to the doped region on the drain side of the transfer gate.
Dependencies are inferred from the claim text.