Wafer pod and wafer positioning mechanism thereof

A wafer positioning mechanism, comprising:

• a base comprising a blocking portion;
• a linking bar, pivoted on the base, comprising:
• a linking body, pivoted on the base;
• a linking shaft, disposed on the linking body, having a trench;
• and
• a resilient portion disposed on the linking body;
• and
• a pushing element, pivoted on the linking shaft, comprising:
• a pushing body;
• a pivoting portion, disposed on the pushing body, having a pivoting slot, wherein the linking shaft is rotatably disposed in the pivoting slot;
• and
• a holding portion, disposed on the pushing body, having a blocking surface,
• wherein when the pushing element is at a retaining position, a bottom surface of the trench faces the blocking surface, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.

A wafer pod for containing at least one wafer, comprising:

• a pod door;
• a cassette, disposed on the pod door, containing the at least one wafer;
• a pod shell, detachably disposed on the pod door, covering the cassette;
• and
• a wafer positioning mechanism, comprising:
• a base, disposed on an inner surface of the pod shell, comprising a blocking portion;
• a linking bar, pivoted on the base, comprising a resilient portion;
• and
• a pushing element pivoted on the linking shaft,
• wherein when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.