Plating apparatus and cleaning device used in the plating apparatus

A plating apparatus for plating a substrate, comprising:

• a substrate holder configured to hold the substrate;
• a dip-type plating bath configured to hold a first plating solution in which the substrate holder holding the substrate is immersed;
• a dry-type plating bath having a hole in a sidewall thereof and configured to hold a second plating solution;
• a transporter configured to transport the substrate holder to the dip-type plating bath and to a predetermined position beside the sidewall of the dry-type plating bath;
• and
• a pressing mechanism configured to press the substrate holder, holding the substrate, against the sidewall of the dry-type plating bath to thereby close the hole with the substrate holder holding the substrate,
• wherein the substrate holder includes a base member and a holding member configured to sandwich the substrate therebetween, a first seal portion configured to seal a gap between the substrate and the holding member, a second seal portion configured to seal a gap between the base member and the holding member, and a third seal portion configured to seal a gap between the holding member and the sidewall of the dry-type plating bath.