Treatment cup cleaning method, substrate treatment method, and substrate treatment apparatus

A substrate treatment method comprising:

• a substrate rotating step of rotating a substrate horizontally held by a substrate rotating unit;
• and
• a treatment liquid supplying step of supplying a treatment liquid to an upper surface and a lower surface of the substrate in the substrate rotating step;
• wherein the treatment liquid scatters from a peripheral edge of the substrate and is captured by an inner wall of a treatment cup surrounding the substrate rotating unit to be supplied to the inner wall in the treatment liquid supplying step, whereby the inner wall is cleaned with the treatment liquid supplied thereto;
• the substrate treatment method further comprising a scattering direction changing step of changing a treatment liquid scattering direction in which the treatment liquid scatters from the peripheral edge of the substrate in the substrate rotating step and the treatment liquid supplying step.

A substrate treatment apparatus comprising:

• a substrate rotating unit which horizontally holds and rotates a substrate about a predetermined rotation axis;
• a treatment liquid supplying unit which supplies a treatment liquid to the substrate being rotated by the substrate rotating unit;
• a treatment cup which has an inner wall surrounding the substrate rotating unit and captures treatment liquid scattering from the substrate held by the substrate rotating unit;
• an upper surface cleaning liquid supplying unit which supplies a cleaning liquid to an upper surface of a substrate being rotated by the substrate rotating unit;
• a lower surface cleaning liquid supplying unit which supplies the cleaning liquid to a lower surface of the substrate being rotated by the substrate rotating unit;
• a cleaning liquid flow rate ratio adjusting unit which adjusts a flow rate ratio between a flow rate of the cleaning liquid being supplied from the upper surface cleaning liquid supplying unit and a flow rate of the cleaning liquid being supplied from the lower surface cleaning liquid supplying unit;
• a cleaning liquid supply controlling unit which controls the substrate rotating unit to rotate the substrate held by the substrate rotating unit, and controls the upper surface cleaning liquid supplying unit and the lower surface cleaning liquid supplying unit to supply the cleaning liquid to the upper surface and the lower surface of the substrate so that the cleaning liquid scatters from a peripheral edge of the substrate to be applied to the inner wall of the treatment cup, whereby the cleaning liquid is supplied to the inner wall of the treatment cup;
• and
• a scattering direction change controlling unit which controls at least one of a rotation speed of the substrate rotating unit and the cleaning liquid flow rate ratio adjusting unit to change a cleaning liquid scattering direction in which the cleaning liquid scatters from the peripheral edge of the substrate.