Substrate processing device and substrate processing method
AssigneeShibaura Mechatronics Corporation
InventorsYuji NAGASHIMA, Jun MATSUSHITA, Konosuke HAYASHI, Kunihiro MIYAZAKI, Masaaki FURUYA, Hidehito AZUMANO, Toyoyasu TAUCHI
Life of this patent
Estimating the term…
Abstract
A substrate processing device 100 includes a solvent replacing unit (organic solvent supply unit 15 and solvent supply unit 34) replacing a cleaning liquid with a volatile solvent of a low concentration, and thereafter further performing replacement with a volatile solvent of a high concentration.
Claims8
A substrate processing device for supplying a cleaning liquid to a surface of a substrate, replacing the cleaning liquid with a volatile solvent, and heating the surface of the substrate to remove the volatile solvent and to dry the surface of the substrate, comprising:
- a solvent replacing unit replacing the cleaning liquid with a volatile solvent of a low concentration, and thereafter performing replacement with a volatile solvent of a high concentration.
A substrate processing method for supplying a cleaning liquid to a surface of a substrate, replacing the cleaning liquid with a volatile solvent, and heating the surface of the substrate to remove the volatile solvent and to dry the surface of the substrate, comprising:
- a solvent replacing step of replacing the cleaning liquid with a volatile solvent of a low concentration, and thereafter performing replacement with a volatile solvent of a high concentration.
Dependencies are inferred from the claim text.