Apparatus and method for manufacturing a semiconductor wafer

A semiconductor wafer chemical mechanical polishing apparatus, comprising:

• a chemical mechanical polishing unit;
• an in-situ cleaning unit comprising:
• a rotation module configured to hold a semiconductor wafer at a plane and revolve the semiconductor wafer around a first axis substantially perpendicular to the plane so as to create a first tangential velocity at a location on the semiconductor wafer, wherein the first tangential velocity is proportional to a distance between the location and a center of the semiconductor wafer;
• and
• a cleaning module configured to revolve around a second axis substantially perpendicular to the first axis so as to create a second tangential velocity at a contact point between the semiconductor wafer and the cleaning module,
• wherein at least one of the rotation module and the cleaning module is configured to move along a direction substantially perpendicular to the first axis and substantially perpendicular to the second axis at a third velocity,
• wherein a relative velocity between the semiconductor wafer and the cleaning module at a center of the semiconductor wafer is not zero,
• a dryer;
• and
• a conveyer configured to transmit the semiconductor wafer between the chemical mechanical polishing unit, the in-situ cleaning unit, and the dryer.

A semiconductor wafer manufacturing method, comprising:

• holding a semiconductor wafer at a plane;
• revolving the semiconductor wafer around a first axis substantially perpendicular to the plane;
• contacting a cleaning module with the semiconductor wafer;
• revolving the cleaning module around a second axis substantially perpendicular to the first axis;
• and
• moving at least one of the semiconductor wafer and the cleaning module along a direction substantially perpendicular to the first axis and substantially perpendicular to the second axis.