US 2015/0085461 A1 · COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD

Abstract

A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

Claims20

Dependent claims

A method for manufacturing a combined wiring board, comprising:

preparing a plurality of wiring boards;
preparing a metal frame having a plurality of opening portions configured to accommodate the plurality of wiring boards, respectively;
positioning the wiring boards in the opening portions of the metal frame, respectively;
and
forming a plurality of crimped portions in the metal frame by plastic deformation such that the sidewalls of the wiring boards bond to sidewalls of the opening portions in the metal frame,
wherein the preparing of the wiring boards includes forming the sidewalls of the wiring boards such that when the wiring boards are positioned in the opening portions of the metal frame, the sidewalls of the wiring boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the metal frame, and the forming of the crimped portions includes generating the plastic deformation such that the sidewalls of the opening portions in the metal frame abut the narrow-space portions of the sidewalls of the wiring boards before the wide-space portions of the sidewalls of the wiring boards.

3 more elements

A combined wiring board, comprising:

a metal frame having a plurality of opening portions;
and
a plurality of wiring boards positioned in the plurality of opening portions in the metal frame, respectively,
wherein the metal frame has a plurality of crimped portions formed by plastic deformation such that sidewalls of the wiring boards are bonding to sidewalls of the opening portions in the metal frame to fix the wiring boards in the opening portions in the metal frame, and the sidewalls of the wiring boards have arc shaped portions which are recessed toward the wiring boards.

1 more element

A combined wiring board, comprising:

a metal frame having a plurality of opening portions;
and
a plurality of wiring boards positioned in the plurality of opening portions in the metal frame, respectively,
wherein the metal frame has a plurality of crimped portions formed by plastic deformation such that sidewalls of the wiring boards are bonding to sidewalls of the opening portions in the metal frame to fix the wiring boards in the opening portions in the metal frame, the sidewalls of the wiring boards have arc shaped portions which are recessed toward the wiring boards and are abutting the sidewalls of the opening portions of the metal frame, and the sidewalls of the metal frame have linear portions abutting linear portions of the sidewalls of the wiring boards adjacent to the arc-shaped portions.

1 more element

Dependencies are inferred from the claim text.

Combined wiring board and method for manufacturing combined wiring board

Life of this patent

Combined wiring board and method for manufacturing combined wiring board

Life of this patent

Abstract

Claims20