Electronic component embedded in ceramic material

An electronic device, comprising:

• a housing;
• a ceramic element affixed to the housing, the ceramic element defining a void;
• an electronic component affixed within the void;
• at least one electronic circuit within the housing and in electrical communication with the electronic component;
• and
• at least one sensor positioned below the at least one electronic circuit.

An electronic device, comprising:

• a housing;
• a cover glass affixed to the housing;
• an electronic component embedded within the cover glass;
• an electronic circuit positioned below the cover glass;
• and
• a sensor positioned below the electronic circuit.
• wherein:
• the electronic circuit includes a touch sensitive circuit, a display stack, and a wireless communication element.

An electronic device comprising:

• a cover glass;
• a trench formed within the cover glass;
• and
• an antenna positioned within at least a portion of the trench, the antenna comprising:
• a protrusion in electrical communication with an electronic circuit positioned below the cover glass.