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US 2015/0084830 A1Published application
Antenna integrated in a package substrate
AssigneeIntel Corporation
InventorsAdel Elsherbini, Telesphor Kamgaing
Life of this patent
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Abstract
An antenna integrated in a package substrate, the antenna comprising an upper antenna element, a lower antenna element and a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.
Claims25
An antenna integrated in a Package substrate, the antenna comprising:
- an upper antenna element;
- a lower antenna element;
- and
- a coupling element disposed between the upper antenna element and the lower antenna element, the coupling element comprising an aperture, and configured to provide a coupling between the upper antenna element and the lower antenna element.
1 more element
An antenna, comprising:
- an upper antenna element;
- a lower antenna element;
- and
- a coupling means for providing coupling between the upper antenna element and the lower antenna element, wherein the coupling means comprises an aperture and is disposed between the upper antenna element and the lower antenna element.
1 more element
A method of manufacturing an antenna integrated in a package substrate, the method comprising:
- forming a lower antenna element;
- forming at least one coupling element disposed above the antenna element;
- and
- forming an upper antenna element disposed above the coupling element,
- wherein the at least one coupling element comprises an aperture and is configured to provide a coupling between the upper antenna element and the tower antenna element.
2 more elements
Dependencies are inferred from the claim text.