Semiconductor device including heat dissipating structure

A semiconductor device comprising:

• a base having a first surface, a second surface opposite to the first surface, and electrodes on the first surface;
• a first semiconductor chip mounted to the first surface of the base;
• a sealing portion sealing the first semiconductor chip and the first surface of the base;
• a plurality of first vias penetrating the sealing portion from a surface of the sealing portion in a thickness direction of the sealing portion and each electrically connected to a corresponding one of the electrodes on the first surface of the base;
• a plurality of external terminals provided on the surface of the sealing portion and each connected to a corresponding one of the first vias;
• a plurality of second vias located inwardly from the first vias and extending from the surface of the sealing portion in the thickness direction of the sealing portion to such a depth that the second vias do not penetrate the sealing portion;
• and
• a heat dissipating body arranged on the surface of the sealing portion opposite to the base, the fifth heat dissipating body being connected to the second vias;
• and
• a conductive re-distribution interconnect layer connecting the first vias to the second vias, wherein
• the second vias are out of contact with the first semiconductor chip.