Methods and apparatus for large diameter wafer handling

A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising:

• a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior;
• a plurality of interconnected wafer supports disposed within said container portion and extending from proximate one of said closed lateral sides to proximate said closed back, said plurality of interconnected wafer supports defining a plurality of V-shaped grooves therebetween, each of said plurality of V-shaped grooves defining a first apex for registration of a respective one of a plurality of wafers therein, said first apex defining a first acute apex angle;
• and
• a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots, each of said plurality of V-shaped slots defining a second apex that is in substantial planar alignment with said first apex of a corresponding one of said plurality of V-shaped grooves for registration of said respective one of said plurality of wafers, said second apex defining a second acute apex angle,
• wherein said second acute apex angle is less than said first acute apex angle.

A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising:

• a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior;
• and
• a plurality of interconnected wafer supports disposed within said container portion and extending from proximate one of said closed lateral sides to proximate said closed back, said plurality of interconnected wafer supports defining a plurality of V-shaped grooves therebetween, each of said plurality of V-shaped grooves defining a first apex for registration of a respective one of a plurality of wafers therein, said first apex defining a first acute apex angle,
• wherein said first acute apex angle varies depending on a positional location along said V-shaped groove.

A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising:

• a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior;
• and
• a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots, each of said plurality of V-shaped slots defining an apex for registration of said respective one of said plurality of wafers, said second apex defining an acute apex angle,
• wherein each of said plurality of V-shaped slots defines a lower leg having an upward-facing engagement surface and an upper leg having a downward-facing engagement surface, said upward-facing engagement surface of said lower leg extending further in a direction towards said open front than said downward-facing engagement surface of said upper leg.