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US 2015/0083480 A1Published application
Interposer board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsSeon Hee MOON, Seung Wook Park, Chang Bae Lee
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Abstract
Disclosed herein are an interposer board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the interposer substrate may include: a base substrate; a circuit pattern formed on the base substrate; and a through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern.
Claims20
An interposer board, comprising:
- a base substrate;
- a circuit pattern formed on the base substrate;
- and
- a through via formed to penetrate through the base substrate and have a height lower than that of the circuit pattern.
1 more element
A method for manufacturing an interposer board, comprising:
- preparing a base substrate on which a through hole is formed;
- forming a first plating layer on the base substrate and an inner wall of the through hole;
- filling a filler in the through hole to have a height lower than that of the inner wall of the through hole;
- forming a second plating layer in the first plating layer and the filler;
- and
- forming a circuit pattern and a through via by patterning the first plating layer and the second plating layer.
3 more elements
Dependencies are inferred from the claim text.