Device embedded printed circuit board and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJong Rip Kim, Han Kim
Life of this patent
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Abstract
Disclosed herein is a device embedded printed circuit board, including: a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof; a build-up layer formed on the first core layer and having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers; and a second core layer formed on the build-up layer and having a cavity.
Claims35
A device embedded printed circuit board, comprising:
- a first core layer having a first via and having a via land for a first connection pad disposed on a lower surface thereof;
- a build-up layer formed on the first core layer and having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers;
- and
- a second core layer formed on the build-up layer and having a cavity.
A method of manufacturing a device embedded printed circuit board, comprising:
- preparing a first core layer which has a first via and has a via land for a first connection pad disposed on a lower surface thereof;
- preparing a carrier;
- forming the first core layer on both surfaces of the carrier;
- forming a build-up layer having a plurality of circuit layers including a second connection pad, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers on the first core layer;
- forming a second core layer having a cavity on the build-up layer;
- and
- separating the first core layer from the carrier.
A method of manufacturing a device embedded printed circuit board, comprising:
- preparing a second core layer having a cavity;
- preparing a carrier;
- forming the second core layer on both surfaces of the carrier;
- mounting a second device in a cavity of the second core layer so as to contact one surface of the carrier;
- forming a build-up layer having a plurality of circuit layers, a plurality of insulating layer disposed between the plurality of circuit layers, and a second via connecting the plurality of circuit layers on the second core layer on which the second device is mounted;
- forming a first core layer having a first via and having a via land for a first connection pad on the build-up layer;
- and
- separating the second core layer from the carrier.
Dependencies are inferred from the claim text.