Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein

A manufacturing method of a multilayer ceramic electronic component to be embedded in a board, the manufacturing method comprising:

• preparing a plurality of ceramic sheets;
• forming an internal electrode pattern on each of the ceramic sheets using a conductive paste;
• forming a ceramic body including first and second internal electrodes opposed to each other therein by stacking the ceramic sheets having the internal electrode pattern formed thereon;
• compressing and sintering the ceramic body;
• and
• forming first and second external electrodes to contact the first and second internal electrodes exposed to both end surfaces of the ceramic body in a length direction to thereby be electrically connected thereto,
• wherein in the forming of the first and second external electrodes, first and second base electrodes are formed on the both end surfaces of the ceramic body in the length direction, conductive thin film layers are formed on both surfaces of the ceramic body in a thickness direction, and plating layers are formed on the first and second base electrodes and the conductive thin film layers.

A printed circuit board having a multilayer ceramic electronic component embedded therein, the printed circuit board comprising:

• an insulation substrate;
• and
• a ceramic body including dielectric layers and having both end surfaces in a length direction, both surfaces in a width direction, and both surfaces in a thickness direction;
• first and second internal electrodes formed to be alternately exposed to the both end surfaces of the ceramic body in the length direction, having the dielectric layers interposed therebetween;
• and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, the first and second external electrodes being formed on the both end surfaces of the ceramic body in the length direction,
• wherein the first and second external electrodes include first and second base electrodes formed on the both end surfaces of the ceramic body in the length direction, conductive thin film layers formed on the both surfaces of the ceramic body in the thickness direction, and plating layers formed on the first and second base electrodes and the conductive thin film layers.