Supporting member separation method and supporting member separation apparatus
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorsYasushi Fujii, Shinji Takase
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Abstract
A supporting member separation method of separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a support plate in this order, the method including an irradiation step in which irradiation of laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater is performed to the release layer.
Claims11
A supporting member separation method of separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a supporting member in this order, the method comprising:
- an irradiation step of irradiating laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater to the release layer.
A supporting member separation apparatus for separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a supporting member in this order, the apparatus comprising:
- an irradiation means of irradiating laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater to the release layer.
Dependencies are inferred from the claim text.