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US 2015/0083171 A1Published application
Method and apparatus for treating at least one substrate in a liquid medium
AssigneeAwt Advanced Wet Technologies GmbH
InventorsHans Hauger, Werner Schulz
Life of this patent
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Abstract
A method for treating at least one substrate (15), particularly wafers, in a liquid medium (3). In a first step, the substrate (15) is lifted in the liquid medium (3) until the substrate (15) is at least partially lifted out of the liquid medium (3) and, in a second step, is passed on at least one point protruding out of the liquid medium (3).
Claims10
1-10. (canceled)
An apparatus for treating a substrate (15) in a liquid medium (3), comprising:
- at least two lifting units (8.1, 8.2) are provided in the liquid medium below a substrate, the first lifting unit (8.1) is provided for raising the substrate (15) in the liquid medium (3) at a lifting speed which is selected in such a way that a Marangoni effect occurs between the substrate and the liquid medium at the moment of exiting from the liquid medium, until the substrate (15) has been raised at least partially out of the liquid medium (3), and wherein the second lifting unit (8.1) accepts the substrate (15) from the first lifting unit (8.2) when the substrate protrudes at least partially out of the liquid medium (3).
Dependencies are inferred from the claim text.