Cobalt substrate processing systems, apparatus, and methods

A method of processing substrates within an electronic device processing system, comprising:

• providing a mainframe having at least one transfer chamber and at least two facets, at least one process chamber coupled to at least one of the at least two facets, and at least one deposition process chamber coupled to at least another one of the at least two facets;
• carrying out a metal reduction process or metal oxide reduction process on substrates in the at least one process chamber;
• and
• carrying out a cobalt chemical vapor deposition process on substrates in the at least one deposition process chamber.

An electronic device processing system, comprising:

• a mainframe having a transfer chamber and at least two facets;
• at least one deposition process chamber coupled to at least one of the at least two facets and adapted to carry out a cobalt chemical vapor deposition process on substrates;
• and
• a load lock apparatus coupled to at least another facet of the at least two facets, the load lock apparatus adapted to carry out a metal reduction or metal oxide reduction process on substrates.

A method of processing substrates within an electronic device processing system, comprising:

• providing a mainframe having a transfer chamber and at least two facets;
• providing one or more deposition process chambers coupled to at least one or the at least two facets;
• providing a load lock apparatus having one or more load lock process chambers coupled to another one of the at least two facets;
• carrying out a metal reduction or metal oxide reduction process on substrates in the one or more load lock process chamber;
• and
• carrying out a cobalt chemical vapor deposition process on substrates in at least one of the one or more deposition process chambers.