Solid state deposition methods, apparatuses, and products

A method for enhancing an appearance of a joint configured to maintain engagement of a first substrate and a second substrate, the method comprising:

• aligning a first substrate and second substrate to define a joined portion, the first substrate and the second substrate combining to include an exterior portion and an interior portion;
• depositing a solid state deposition layer at the joined portion, the solid state deposition layer positioned on the exterior portion of the first substrate and the second substrate;
• and
• inserting a mechanical structure that engages the first substrate and the second substrate, the mechanical structure proximate to the interior portion, wherein the first substrate and the second substrate are held together by the solid state deposition layer and the mechanical structure.

A method of enhancing the appearance of a first substrate and a second substrate joined together by a solid state deposition, the method comprising:

• engaging the first substrate with the second substrate, the first substrate and the second substrate forming a portion of an enclosure of an electronic device;
• and
• applying a solid state deposition over the first substrate and the second substrate,
• wherein the first substrate and the second substrate have a first appearance, and wherein the solid state deposition has a second appearance different from the first appearance.