Cooling fluid flow passage matrix for electronics cooling
AssigneeHamilton Sundstrand Corporation
InventorsRichard A. Himmelmann, Joseph Turney
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Abstract
A cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed.
Claims20
A cooling package for an electronic component comprising:
- a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels, said outer supply channels and said outer return channels communicating with distinct ones of openings in a slot layer and into return and supply slots, respectively;
- and
- an orifice layer for supplying fluid to an electronic component to be cooled from said supply slots and for receiving return fluid after having cooled the electronic component and returning the received fluid into said return slots.
A cooling supply and electronic component combination comprising:
- an electronic component having a face in contact with a cooling fluid package;
- the cooling fluid package including a supply port communicating with a plurality of outer supply channels, and a return port communicating with a plurality of outer return channels, said outer supply channels and said outer return channels communicating with distinct ones of openings in a slot layer, and said slot layer having columns separating channels within said slot layer into slot return and supply channels;
- and
- an orifice layer for supplying fluid to said electronic component and for receiving return fluid after having cooled the electronic component.
Dependencies are inferred from the claim text.