Chip electronic component and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHan Wool RYU, Gwang Hwan HWANG, Kwi Jong LEE, Hwan Soo LEE, Hang Kyu CHO
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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHan Wool RYU, Gwang Hwan HWANG, Kwi Jong LEE, Hwan Soo LEE, Hang Kyu CHO
Estimating the term…
A magnetic paste composition for a chip electronic component, a chip electronic component, and a manufacturing method therof are provided. The chip electronic component is capable of being manufactured in a thin-film to allow for thinness and miniaturization thereof, thereby preventing a deterioration in efficiency thereof due to core loss even under high frequency and high current conditions. The chip electronic component exhibits high permeability, high efficiency, and a high Isat value by decreasing porosity.
A chip electronic component, comprising:
A manufacturing method of a chip electronic component, the manufacturing method comprising:
A chip electronic component, comprising:
Dependencies are inferred from the claim text.