Imprinting method, imprinting apparatus, and device manufacturing method

An imprinting method for forming a pattern on a substrate supported by a substrate holding unit having at least a first attraction area and a second attraction area, attraction forces of the first attraction area and the second attraction area being changeable, the substrate having a plurality of shot areas, each having an alignment mark formed therein, the pattern being formed in each of the shot areas by curing an imprint material supplied on the substrate with the imprint material in contact with a mold, the method comprising:

• when the pattern is sequentially formed in each of the shot areas after arrangement information regarding the shot areas are acquired, the substrate is moved on the basis of the arrangement information to detect a alignment mark in each of the shot areas, and the position of each of the shot areas is acquired using a result of the detection,
• reducing the attraction force of the first attraction area to less than the attraction force of the second attraction area;
• changing the attraction forces of the first attraction area and the second attraction area after forming the pattern in the shot area corresponding to the first attraction area;
• detecting the alignment mark in the shot area corresponding to the second attraction area and obtaining position information regarding the shot area corresponding to the second attraction area;
• comparing the obtained position information with the position information regarding the shot area corresponding to the second attraction area based on the arrangement information;
• moving the substrate on the basis of the arrangement information to detect the alignment mark of the shot area and performing positioning of the substrate and the mold using the result of detection if the difference between the compared two position information is less than or equal to a threshold value;
• and
• obtaining the arrangement information regarding the shot areas again and moving the substrate on the basis of the obtained arrangement information to detect the alignment mark of the shot area and performing positioning of the substrate and the mold using the result of detection if the difference is greater than the threshold value.

An imprinting apparatus for forming a pattern on a substrate by curing an imprint material with the imprint material in contact with a mold for each of a plurality of shot areas of the substrate, the apparatus comprising:

• a detecting unit configured to detect a alignment mark formed in each of the shot areas;
• a substrate holding unit configured to hold the substrate, the substrate holding unit having at least a first attraction area and a second attraction area, attraction forces of the first attraction area and the second attraction area being changeable;
• a positioning unit configured to achieve relative positioning of the substrate and the mold;
• and
• a control unit configured to control operations of the detecting unit, the substrate holding unit, and the positioning unit, the control unit acquiring the arrangement information of the shot areas and sequentially forming the pattern in each of the shot areas using the arrangement information,
• wherein the control unit controls the substrate holding unit to reduce the attraction force of the first attraction area to less than the attraction force of the second attraction area,
• wherein after the pattern is formed in the shot area corresponding to the first attraction area, the control unit changes the attraction forces of the first attraction area and the second attraction area,
• wherein the control unit controls the detecting unit to detect the alignment mark in the shot area corresponding to the second attraction area, obtain position information regarding the shot area corresponding to the second attraction area, and compare the obtained position information with the position information regarding the shot area corresponding to the second attraction area based on the arrangement information, and
• wherein if the difference between the two compared position information is less than or equal to a threshold value, the control unit controls the positioning unit to achieve relative positioning of the substrate and the mold using the arrangement information, and if the difference is greater than the threshold value, the control unit controls the positioning unit to obtain the arrangement information regarding the shot areas again and achieve relative positioning of the substrate and the mold using the obtained arrangement information.

A method for manufacturing a device for use in an imprinting apparatus, comprising:

• forming a pattern in an imprint material provided on a substrate;
• and
• processing the substrate using the pattern formed in the imprint material,
• wherein the imprinting apparatus forms a pattern on the substrate by curing the imprint material supplied on the substrate with the imprint material in contact with a mold for each of a plurality of shot areas of the substrate,
• wherein the imprinting apparatus includes a detecting unit that detects an alignment mark formed in each of the shot areas,
• a substrate holding unit that has at least a first attraction area and a second attraction area to hold the substrate and that allows attraction forces of the first attraction area and the second attraction area to be changeable,
• a positioning unit configured to achieve relative positioning of the substrate and the mold, and
• a control unit that controls operations of the detecting unit, the substrate holding unit, and the positioning unit and that acquires arrangement information of the shot areas and sequentially forms the pattern in each of the shot areas using the arrangement information,
• wherein the control unit controls the substrate holding unit to reduce the attraction force of the first attraction area to less than the attraction force of the second attraction area,
• wherein after the pattern is formed in the shot area corresponding to the first attraction area, the control unit changes the attraction forces of the first attraction area and the second attraction area,
• wherein the control unit controls the detecting unit to detect the alignment mark in the shot area corresponding to the second attraction area, obtain position information regarding the shot area corresponding to the second attraction area, and compare the obtained position information with the position information regarding the shot area corresponding to the second attraction area based on the arrangement information, and
• wherein if the difference between the compared position information is less than or equal to a threshold value, the control unit controls the positioning unit to achieve relative positioning of the substrate and the mold using the arrangement information, and if the difference is greater than the threshold value, the control unit controls the positioning unit to obtain the arrangement information regarding the shot areas again and achieve relative positioning of the substrate and the mold using the obtained arrangement information.