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US 2015/0028468 A1Published application
Non-leaded type semiconductor package and method of assembling same
AssigneeFreescale Semiconductor, Inc.
InventorsZhigang Bai, Zhijie Wang, Jinzhong Yao
Life of this patent
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Abstract
A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.
Claims14
A semiconductor package, comprising:
- a die flag having an upper surface and a lower surface;
- a semiconductor die attached on the upper surface of the die flag;
- a plurality of leads surrounding the die flag, wherein each of the leads has a top surface and a bottom surface opposite to the top surface, and the top surface is electrically connected with the semiconductor die with a bond wire;
- and
- a mold cap that covers the semiconductor die, bond wires, and at least a portion of each of the leads, wherein the mold cap comprises a generally rectangular mold body, and wherein the mold body has reinforced corners comprising mold columns that protrude from each of said corners.
2 more elements
A method of assembling a semiconductor package, comprising:
- providing a lead frame including a die flag and a plurality of leads surrounding the die flag, wherein each of the leads has a top surface and a bottom surface opposite to the top surface;
- bonding a semiconductor die on a top surface of the die flag;
- electrically connecting bonding pads on a top surface of the semiconductor die with the top surfaces of the leads with bond wires;
- forming a mold cap by encapsulating the die flag, the semiconductor die, the bond wires and at least a portion of each of the leads with a mold compound, wherein the mold cap comprises a generally rectangular mold body with reinforced corners comprising mold columns that protrude from each of said corners;
- and
- performing a trim and form operation that removes portions of the lead frame that extend beyond said mold cap.
3 more elements
Dependencies are inferred from the claim text.