Assembly and packaging of mems device
AssigneeInvenSense, Inc.
InventorsBrian H. Kim, Haijun She, Mozafar Maghsoudnia
Life of this patent
Estimating the term…
Abstract
A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
Claims30
A method of manufacturing a Micro Electro Mechanical systems (MEMS) device comprising:
- bonding a plurality of solder bumps on a substrate of a wafer;
- dicing a CMOS-MEMS wafer to separate a plurality of CMOS-MEMS die, the plurality of CMOS-MEMS die including a MEMS die, a CMOS die, and a plurality of stud bumps,
- wherein the plurality of stud bumps is attached to the CMOS die;
- cleaning the plurality of stud bumps;
- positioning the plurality of CMOS-MEMS die on top of the substrate;
- heating the positioned CMOS-MEMS die thereby causing a reflow and connection between the CMOS die and the substrate through the plurality of stud bumps and the plurality of solder bumps;
- underfilling a space disposed between the CMOS die and the substrate;
- curing the underfilled die;
- and
- singulating the substrate.
A method of manufacturing a Micro Electro Mechanical systems (MEMS) device comprising:
- bonding a plurality of solder bumps on a substrate of a wafer;
- dicing a CMOS-MEMS wafer to separate a CMOS-MEMS die, the CMOS-MEMS die including a MEMS die, a CMOS die, and a plurality of stud bumps;
- dispensing a non-conductive paste on the plurality of solder bumps;
- positioning the CMOS-MEMS die on top of the substrate;
- thermally compressing the positioned die from top and bottom to form a connection between the CMOS die and the substrate through the plurality of stud bumps and the plurality of solder bumps;
- curing the CMOS-MEMS die after thermally compressing;
- and
- singulating the substrate.
A method of manufacturing a MicroElectroMechanical systems (MEMS) device comprising:
- bonding a plurality of solder bumps on a substrate of a wafer;
- dicing a CMOS-MEMS wafer to separate a CMOS-MEMS die, the CMOS-MEMS die including a MEMS die , a CMOS die, and a plurality of stud bump;
- positioning the CMOS-MEMS die on top of the substrate;
- thermally compressing the CMOS-MEMS die from the top, and bottom and forming a connection between the CMOS die and the substrate through the plurality of stud bumps and the plurality of solder bumps;
- underfilling a space between the CMOS die and the substrate;
- curing the underfilled CMOS-MEMS die;
- and
- singulating the substrate.
A microelectromechanical systems (MEMS) device comprising:
- a substrate;
- a plurality of solder bumps formed on the substrate;
- a CMOS-MEMS die including a CMOS die and a MEMS die vertically stacked;
- and
- a plurality of stud bumps on the CMOS die, wherein the plurality of stud bumps and the plurality of solder bumps being positioned between the substrate and the CMOS die to define a height between the CMOS die and the substrate,
- wherein the at least one stud bump and the plurality of solder bumps causes an electrical connection between the CMOS die and the substrate.
Dependencies are inferred from the claim text.