Organic light-emitting device and method for producing same

A method for manufacturing an organic light-emitting device, comprising:

• forming an underlayer above a substrate;
• forming a partition wall on the underlayer that covers a first part of a surface of the underlayer and surrounds a second part of the surface of the underlayer;
• forming an applied film by applying ink that contains organic material into a recess formed by the partition wall surrounding the second part;
• and
• forming, by drying the applied film, an organic film that is in contact with the surface of the underlayer and the surface of the partition wall, wherein
• in forming the underlayer, the surface of the underlayer has a protruding portion that protrudes in an upwards direction, the protruding portion being composed of a top surface and an inclined surface that surrounds the top surface, and
• in forming the partition wall, the first part includes at least the top surface and a portion of the inclined surface, such that an inner edge of the partition wall is in contact with the inclined surface or a level portion of the surface of the underlayer that is not the protruding portion.

A method for manufacturing an organic light-emitting device, comprising:

• forming an underlayer above a substrate;
• forming a partition wall on the underlayer that covers a first part of a surface of the underlayer and surrounds a second part of the surface of the underlayer;
• forming an applied film by applying ink that contains organic material into a recess formed by the partition wall surrounding the second part;
• and
• forming, by drying the applied film, an organic film that is in contact with the surface of the underlayer and the surface of the partition wall, wherein:
• in forming the underlayer, the surface of the underlayer has a protruding portion that protrudes in an upwards direction, the protruding portion being composed of a top surface and an inclined surface that surrounds the top surface;
• in forming the partition wall, the first part includes at least the top surface and a portion of the inclined surface, such that an inner edge of the partition wall is in contact with the inclined surface or a level portion of the surface of the underlayer that is not the protruding portion;
• in forming the applied film, the applied film is applied so as to cover the entirety of the level portion, a portion of the inclined surface of the protruding portion not covered by the partition wall, and a portion of the partition wall, and is applied so as to have a film thickness of a1 nanometers that is greater than b nanometers;
• and
• in forming the organic film,
• a1>a2≧(b/15)
• where a2 is an average film thickness in nanometers of the organic film above the level portion and b is a difference in height in nanometers of a position where the inner edge of the partition wall contacts the surface of the underlayer and the level portion.