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US 2015/0028254 A1Published application
Composition and method for polishing bulk silicon
AssigneeCabot Microelectronics Corporation
InventorsBrian REISS, John CLARK, Lamon JONES, Jeffrey GILLILAND, Michael WHITE
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Abstract
The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.
Claims19
1-48. (canceled)
A chemical-mechanical polishing composition consisting essentially of:
- (a) about 0.5 wt. % to about 20 wt. % of silica,
- (b) about 0.02 wt. % to about 5 wt. % of one or more nitrogen-containing heterocyclic compounds,
- (c) about 0.05 wt. % to about 2 wt. % of one or more aminophosphonic acids,
- (d) about 0.1 wt. % to about 5 wt. % of one or more tetraalkylammonium salts,
- (e) optionally one or more bicarbonate salts, and
- (f) water,
- wherein the polishing composition has a pH of about 7 to about 11.
4 more elements
Dependencies are inferred from the claim text.