Holding apparatus, holding method thereof, wire electrical discharge machining apparatus, and machining method thereof
AssigneeCanon Marketing Japan Kabushiki Kaisha
InventorTakayuki Yagashiro
Life of this patent
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AssigneeCanon Marketing Japan Kabushiki Kaisha
InventorTakayuki Yagashiro
Estimating the term…
A holding apparatus, which is used in electrical discharge machining for cutting a workpiece into slices at intervals of wires arranged in parallel to each other, includes: a holding unit for holding the workpiece so as to prevent the workpiece from falling from the holding apparatus; and an energization unit for energizing the workpiece so as to pass current through the workpiece. The holding unit is disposed outside a place at which the wires and the holding unit interfere with each other. The energization unit is disposed at a place at which the cutting of the workpiece into slices by the wires ends. A portion of the energization unit, which is brought into contact with the workpiece at the place at which the cutting of the workpiece into slices ends, has a surface shape that is prevented from conforming to a machining surface of the workpiece.
A holding apparatus, which is used in electrical discharge machining for cutting a workpiece into slices at intervals of wires arranged in parallel to each other, the holding apparatus comprising:
A method of holding a workpiece by using a holding apparatus used in electrical discharge machining for cutting the workpiece into slices at intervals of wires arranged in parallel to each other, the method comprising:
A wire electrical discharge machining apparatus for cutting a workpiece into slices at intervals of wires arranged in parallel to each other, the wire electrical discharge machining apparatus comprising:
A method of machining a workpiece by using a wire electrical discharge machining apparatus for cutting the workpiece into slices at intervals of wires arranged in parallel to each other, the method comprising:
Dependencies are inferred from the claim text.