Compositions and methods for selectively etching titanium nitride
AssigneeAdvanced Technology Materials, Inc.
InventorsJeffrey A. Barnes, Emanuel I. Cooper, Li-Min Chen, Steven Lippy, Rekha Rajaram, Sheng-Hung Tu
Life of this patent
Estimating the term…
Abstract
Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.
Claims22
1-19. (canceled)
A composition for selectively removing titanium nitride and/or photoresist etch residue material from the surface of a microelectronic device having same thereon, said composition comprising at least one oxidizing agent, at least one etchant, at least one metal corrosion inhibitor, and at least one solvent.
(canceled)
Dependencies are inferred from the claim text.