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US 2015/0027761 A1Published application
Printed circuit board and method of manufacturing the same
AssigneeSamsung Display Co., Ltd.
InventorsHyuk-Hwan KIM, Young-Jun SEO, Jung-Kyun KIM, Seok-Hyun NAM
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Abstract
A printed circuit board includes a first seed layer, a second seed layer, and a metal layer. The first and second seed layers are disposed on a base substrate and spaced apart from each other. The metal layer covers the first and second seed layers except a first side of the first seed layer and a second side of the second seed layer. The first side of the first seed layer faces the second side of the second seed layer.
Claims20
A printed circuit board comprising:
- a first seed layer and a second seed layer disposed on a base substrate and spaced apart from each other;
- and
- a metal layer configured to cover the first and second seed layers except a first side of the first seed layer and a second side of the second seed layer, wherein the first side of the first seed layer faces the second side of the second seed layer.
A method of manufacturing a printed circuit board comprising:
- forming a mask pattern on a base substrate;
- forming a first seed layer and a second seed layer on the base substrate, wherein the first seed layer is spaced apart from the second seed layer and the first seed layer covers a first corner of the mask pattern and the second seed layer covers a second corner of the mask pattern;
- selectively forming a metal layer on the first and second seed layers;
- and
- removing the mask pattern from the base substrate, thereby exposing the base substrate underlying the mask pattern.
2 more elements
A method of manufacturing a printed circuit board comprising:
- forming a first seed layer and a second seed layer on a base substrate, wherein the first seed layer is spaced apart from the second seed layer;
- forming an active portion on the base substrate disposed between the first seed layer and the second seed layer, a portion of the first seed layer and a portion of the second seed layer;
- selectively forming a metal layer on the first and second seed layers and the active portion;
- and
- removing a portion of the metal layer disposed on the active pattern, thereby exposing the active pattern.
2 more elements
Dependencies are inferred from the claim text.